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Introduction to High-Speed Circuit and Interconnect Analysis (2Hr)

M. Nakhla   and   R. Achar

(ISBN 0-9731047-0-8; First Edition: May 1, 2002; Omniz Global Knowledge Corporation)

This multimedia book provides an introduction and a comprehensive treatment of signal integrity related high-frequency effects (such as delay, crosstalk, attenuation, reflections, ringing, skin effect, ground bounce, etc.), in VLSI and microwave circuits.

The book discusses various high-frequency design issues and modeling strategies for high-speed interconnects. The book introduces the concept of what is meant by “high-speed” and proceeds to give an insight into signal integrity effects through dazzling animations, reinforced with the audio. The book starts with the very basic fundamentals, provides ample number of examples of signal integrity effects, illustrations and literature reviews. The book has been developed in an easy-to-understand style and with in-depth coverage. No previous knowledge of the area is required by readers.

The material presented is useful for designers, CAD tool developers as well as to those interested in understanding signal integrity issues and their impact on high-speed circuits. It is also very useful to managers, application engineers and the marketing staff. This CD based multimedia book contains approximately two hours of intense multimedia presentations and is offered in a user-friendly desk-top environment where one can learn in-depth valuable material at his own pace and chosen time-schedule.


  1. Introduction and Basic Concepts

  2. High-Speed Design Issues

  3. High-Frequency Interconnect Models

  4. Exam-1;    Exam-2

  5. References

I. Introduction and Basic Concepts

1. Significance: High-Speed Circuit and Interconnect analysis
2. What is High-Speed?
3. References

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II. High-Speed Design Issues

1. High Frequency Effects
2. Delay
3. Attenuation
4. Ringing and Reflections
5. Crosstalk
6. Current Distribution Related Effects
      * Skin Effect,   
      * Edge Effect,   
      * Proximity Effect
7. Ground Bounce
      * Example
8. Exam;     Test-Match;      References

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III. High-Frequency Interconnect Models

1. Modeling Issues
2. Lumped Models: RC, RLC
3. Distributed Transmission Line Models
4. Frequency-Dependent Parameters
5. Full-Wave Models
6. Measured Models
7. EMI models
8. Exam,     Test-Match,     References

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IV. Exam

There are two complete exams in this book which are designed to test the level of one's understanding after completing the study. The questions are such that they broadly cover the material taught in the course and are formulated to reinforce the concepts learnt during the study. The solutions, corrected exam and the final marks are provided after the completion of the exam.

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V. References

A Comprehensive list of related references in the leading IEEE international journals and conferences is provided.

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Copyright © 2002, Omniz Global Knowledge Corporation. All rights reserved.
Revised: 07/20/2002

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